高通发布骁龙808六核/810八核64位芯片

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The Snapdragon 808 processor is a 64-bit enabled, LTE-equipped chipset for premium mobile computing devices. The Snapdragon 808 processor is anticipated to begin sampling in the second half of 2014 and expected to be available in commercial devices by the first half of 2015.

骁龙808是64位6核心处理器，支持LTE的高端移动设备处理器。808于2014年下半年开始送样。2015年上半年开始量产商用。

主要区别是810是八核。

CPU	Dual-core ARM® Cortex™ A57 and quad-core A53 with 64-bit support
GPU	Qualcomm® Adreno™ 418 GPU
DSP	Hexagon™ V56 DSP (up to 800MHz)
Modem	Integrated 4G LTE Advanced CAT6 World Mode modem, supporting LTE FDD, LTE TDD, WCDMA (DC-HSPA+, DC-HSUPA), CDMA1x, EV-DO Rev. B, TD-SCDMA and GSM/EDGE CAT6 speeds of up to 300 Mbps with support for up to 3x20 MHz carrier aggregation on LTE FDD and LTE TDD 4th Generation integrated LTE modem, with support for LTE- Broadcast, LTE multimode dual-SIM (DSDS and DSDA) and HD VoLTE with SRVCC
RF	4th gen power efficient LTE multimode transceiver with Qualcomm RF360™ Front End solution for world mode bands, lower power and PCB reduction
USB	USB 3.0/2.0
Bluetooth	BT 4.1
WiFi	Qualcomm® VIVE™ 2-stream 802.11n/ac with MU-MIMO
GPS	Qualcomm® IZat™ Gen8C
NFC	Supported
Video	4K playback with H.264 (AVC) and H.265 (HEVC) formats 4K capture with H.264 format DASH supported
Camera	Up to 55 MP Dual ISP
Display	2560x1600 on-device display concurrent with 4K Ultra HD output to HDTV 1080p and 4K external displays supported
Quick Charge	Qualcomm® Quick Charge™ 2.0 technology PMI8994 Integrated HW Voltage In = 9V, up to 3A out Supports parallel charging
Memory/Storage	LPDDR3 933MHz Dual-channel 32-bit (12.8GBps)/eMMC 5.0 SD 3.0 (UHS-I)
Process Technology	20nm

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